ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,202, issued on July 14, was assigned to National Technology & Engineering Solutions of Sandia LLC (Albuquerque, N.M.). "Multiaxial magnetic... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,203, issued on July 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Bump integration with redistributio... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,204, issued on July 14, was assigned to CHIPBOND TECHNOLOGY Corp. (Hsinchu, Taiwan). "Chip on film package with multilayer composite bumps ... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,206, issued on July 14, was assigned to Nippon Micrometal Corp. (Saitama, Japan) and NIPPON STEEL Chemical & Material Co. Ltd. (Tokyo). "AI... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,209, issued on July 14, was assigned to Nexperia B.V. (Nijmegen, Netherlands). "Semiconductor package with a cured electrically conductive ... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,210, issued on July 14, was assigned to LUXIS PRECISION INTELLIGENT MANUFACTURING (KUNSHAN) Co. LTD. (Kunshan City, China). "Multi-chip pac... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,211, issued on July 14, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung City, Taiwan). "Electronic package and manufact... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,212, issued on July 14, was assigned to Mitsubishi Electric Corp. (Tokyo). "Switching device electrically connected to a lead frame by a bo... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,213, issued on July 14, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package and method for manufac... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,214, issued on July 14, was assigned to Amkor Technology Singapore Holding Pte. Ltd. (Singapore). "Semiconductor devices and methods of man... Read More